The global fan-out packaging market (henceforth, referred to as the market studied) was valued at USD 1126.91 million in 2020, and it is expected to reach USD 3,559.28 million by 2026, with an estimated CAGR of 18.1%, during 2021-2026 (henceforth, referred to as the forecast period). Approximately more than 20% thinner than traditional Flip Chip assembly, fan out packaging is supplementing the trend of slim profile of smart phones.
With the outbreak of COVID 19, the semiconductor packaging market witnessed a decline in growth due to restrictions on the movement of goods and severe disruptions in the semiconductor supply chain. In the Q1 of 2020, COVID-19 caused low inventory levels for clients of semiconductor vendors and distribution channels.
Click Here to Download Sample Report >> https://www.sdki.jp/sample-request-114731
Panel Level Packaging to Hold a Significant Share during the Forecast Period
Several packaging houses are implementing panel-level fan-out, a low-density technology that promises to lower the cost of fan-out. FOPLP is expected to be essential for future applications on 5G, AI, Biotech, Advanced Driver- Assistance System (ADAS), smart city, and IoT related products. Ability to develop advanced packing and testing services and secure customer relations serve as major factors.
Taiwan to Hold a Significant Share in the Market
Taiwan houses some of the major semiconductor manufacturing companies which are fueling the demand for advanced semiconductor packaging especially in PLPs. According to the Semiconductor Industry Association (SIA), Asia-Pacific generates more than 50% revenue for global semiconductor sales, this in turn, is providing Taiwanese vendors with an opportunity to supply FOWLP for increased semiconductor applications.